Mentor Graphics: Using co-design to ensure multi-fabric systems design success

January 30, 2017 // By Mentor Graphics
This white paper discusses how the need to step up to system-level design exposes certain design philosophy limitations and the need to bridge the differences to chip, packaging, and PCB design. In this context it discusses how multi-substrate visualization, system-level cross substrate interconnect untangling, and cross-substrate co-design can be used to help product a better system product.
Company: 
design, EDA, Mentor Graphics