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ADI - Xilinx collaboration streamlines base station design July 29, 2010 ADI - Xilinx collaboration streamlines base station design Analog Devices Inc. has collaborated with Xilinx Inc to introduce a radio architecture development platform that helps multi-carrier cellular base station manufacturers reduce engineering resources and improve time to market. Read more NXP buys Jennic, boosts short-range RF portfolio July 26, 2010 Dutch chip company NXP has acquired Jennic, a fabless chip company offering wireless connectivity ICs, for $12.2 million plus an additional $7.8 million over the next two years if Jennic meets certain performance targets. Read more Cypress achieves multitouch design-win in world's first two-part mobile phone design July 21, 2010 Cypress's CY8CTMG200 controller will be used in the touchscreen of the world's first separable handset from NTT DOCOMO, the docomo PRIME series F-04B mobile phone. Read more Exar signs up Arrow Electronics for European distribution July 20, 2010 Exar signs up Arrow Electronics  for European distribution Exar Corporation has signed a pan-European distribution agreement with Arrow Electronics, a leading worldwide distributor of electronic components and solutions, which will see Arrow Electronics distribute Exar's entire product portfolio consisting of solutions from the Datacom and Storage, Power, Communications ... Read more On Semiconductor to acquire Sanyo Semiconductor to enhance its manufacturing scale July 15, 2010 On Semiconductor to acquire Sanyo Semiconductor to enhance its manufacturing scale On Semiconductor Corporation and Sanyo Electric Co., Ltd. announced the signing of a definitive purchase agreement providing for the acquisition of Sanyo Semiconductor Co., Ltd., a subsidiary of Sanyo Electric, and other assets related to the company's semiconductor business, by ON Semiconductor in a ... Read more TI expands analog production capacity by acquiring two wafer fabs from Spansion July 15, 2010 TI expands analog production capacity by acquiring two wafer fabs from Spansion Texas Instruments has announced it will purchase two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan. The assets currently are operated by Spansion Japan Limited (SJL) and are being acquired under a court-approved plan of reorganization. Read more Atmel sells its smart card business to Inside Contactless June 28, 2010 Atmel sells its smart card business to Inside Contactless Atmel Corporation has entered into a definitive agreement to sell its Smart Card (SMS) business based in Rousset, France and East Kilbride, UK to Inside Contactless S.A. following the completion of the information and consultation process with the works council of Atmel Rousset in France. Read more CMP partners with CMC and MOSIS to introduce a 3D-IC process June 22, 2010 CMP partners with CMC and MOSIS to introduce a 3D-IC process A 3D-IC MPW service based on Tezzaron's SuperContact technology and GLOBALFOUNDRIES 130nm CMOS is to be offered by a partnership formed between Grenoble-based broker in ICs and MEMS for prototyping and low volume production, CMP, and CMC Microsystems, a non-profit organization that supports microelectronics ... Read more National Semiconductor acquires GTronix June 21, 2010 National Semiconductor acquires GTronix National Semiconductor Corp. has acquired the technology of GTronix of Fremont, California, USA, a fabless semiconductor company specializing in programmable and adaptive analog sensory processing technology. Read more STMicroelectronics and Tsinghua University agree strategic research partnership June 18, 2010 STMicroelectronics and Tsinghua University agree strategic research partnership STMicroelectronics and Tsinghua University, Shenzhen Graduate School, have reached a long-term strategic research partnership agreement which is the second phase of a collaboration that began in 2002 with the setup of a joint ASIC (Application Specific Integrated Circuit) research center. Read more
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