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ADI - Xilinx collaboration streamlines base station design July 29, 2010
Analog Devices Inc. has collaborated
with Xilinx Inc to introduce a radio architecture development platform
that helps multi-carrier cellular base station manufacturers reduce
engineering resources and improve time to market.
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NXP buys Jennic, boosts short-range RF portfolio
July 26, 2010
Dutch chip company NXP has acquired Jennic, a fabless chip company offering wireless connectivity ICs, for $12.2 million plus an additional $7.8 million over the next two years if Jennic meets certain performance targets.
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Cypress achieves multitouch design-win in world's first two-part mobile phone design
July 21, 2010
Cypress's CY8CTMG200 controller will be used in the touchscreen of the
world's first separable handset from NTT DOCOMO, the docomo PRIME series
F-04B mobile phone.
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Exar signs up Arrow Electronics for European distribution
July 20, 2010
On Semiconductor Corporation and Sanyo Electric Co., Ltd. announced the signing of a definitive purchase agreement providing for the acquisition of Sanyo Semiconductor Co., Ltd., a subsidiary of Sanyo Electric, and other assets related to the company's semiconductor business, by ON Semiconductor in a ...
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TI expands analog production capacity by acquiring two wafer fabs from Spansion
July 15, 2010
Texas Instruments has announced it will purchase two wafer fabs and manufacturing equipment located in Aizu-Wakamatsu, Japan. The assets currently are operated by Spansion Japan Limited (SJL) and are being acquired under a court-approved plan of reorganization.
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Atmel sells its smart card business to Inside Contactless
June 28, 2010
Atmel Corporation has entered into a definitive agreement to sell its Smart Card (SMS) business based in Rousset, France and East Kilbride, UK to Inside Contactless S.A. following the completion of the information and consultation process with the works council of Atmel Rousset in France.
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CMP partners with CMC and MOSIS to introduce a 3D-IC process
June 22, 2010
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