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Multi-channel combined temperature and pressure charge amplifier February 06, 2012 Multi-channel combined temperature and pressure charge amplifier Kistler's Type 5155A multi-channel temperature and pressure charge amplifier was expressly designed to convert the charge signal from all types of piezoelectric sensors and Type K thermocouples into a proportional voltage output signal, for the effective monitor, control and optimization of injection ... Read more High density hot swap front-ends deliver up to 650-W February 06, 2012 High density hot swap front-ends deliver up to 650-W Unipower LLC has introduced the SGH 3000 Series of 650 W, 12 V front-ends designed to satisfy the latest networking and datacom applications that demand smaller size, lower energy consumption and a reduced cost of ownership. Read more Portable accelerometer shaker and calibration system February 06, 2012 Portable accelerometer shaker and calibration system Meggitt Sensing Systems' Endevco model 28959F/28959FV is a portable accelerometer shaker and calibration system with integral signal conditioning, designed to provide both excitation and high-precision NIST-traceable calibrations of charge mode piezoelectric, voltage mode piezoelectric, piezoresistive, ... Read more 0.37-mm ultra-flat package Schottky rectifiers handle currents up to 1.5-A February 03, 2012 0.37-mm ultra-flat package Schottky rectifiers handle currents up to 1.5-A NXP Semiconductors is claiming a major new benchmark in miniaturization with the launch of the company’s next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic ... Read more CMOS timing startup raises $2.3 million February 03, 2012 CMOS timing startup raises $2.3 million EoSemi Ltd., (Congleton, England), a developer of CMOS replacements for quartz oscillators, has announced it has secured a $2.3 million (£1.5milion) second tranche of funding. Read more X-FAB enhances advanced mixed-signal process design kit with Silicon Frontline's post-layout extraction software February 03, 2012 X-FAB enhances advanced mixed-signal process design kit with Silicon Frontline's post-layout extraction software X-FAB Silicon Foundries has used Silicon Frontline Technology, Inc’s R3D (Resistive 3D) software for X-FAB’s 0.18 micrometer high-voltage process (XH018), to provide improvements in reliability and efficiency by addressing the high-voltage and driver characteristics of mixed-signal SOC designs. Read more LED driver controller for up to 20 high current LEDs operate from 60V down to 5.0V February 03, 2012 LED driver controller for up to 20 high current LEDs operate from 60V down to 5.0V By extending input voltage operation from 60V down to as low as 5.0V, the ZXLD1371 LED driver controller from Diodes Incorporated is designed to handle as broad a range of applications as possible, including those subject to the greatest variance in input voltage, such as automotive lighting and 12VAC ... Read more ALPS starts mass production of new high-precision latch 2-phase type magnetic sensor February 02, 2012 ALPS starts mass production of new high-precision latch 2-phase type magnetic sensor ALPS ELECTRIC EUROPE GmbH has developed the HGPRDT Series high-precision latch 2-phase output type magnetic sensor for use in automotive equipment, supporting a wide operating temperature range between –40 and +140°C, and high voltages up to 30 V. Mass production commenced in January 2012. Read more LEM introduces transducer series for ultra-accurate current measurement up to 24-kA February 02, 2012 LEM introduces transducer series for ultra-accurate current measurement up to 24-kA LEM has introduced the ITZ series of transducers for galvanically-isolated, ultra-accurate precision DC, AC and pulsed current measurements in industrial and laboratory applications. Read more 5GHz WiFi front-end module in a 3.2x3.2x0.6mm footprint February 02, 2012 5GHz WiFi front-end module in a 3.2x3.2x0.6mm footprint Avago Technologies has launched the AFEM-S105, a front-end module for WiFi access points that integrates a power amplifier, directional coupler, and SPDT antenna switch in a 3.2x3.2x0.6mm package. The power amplifier is optimized for IEEE 802.11 a/n WiFi modulation, helping the module streamline design ... Read more
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TI's integration strategy for National Semiconductor devices begins to take shape In this news analysis article EE Times Europe Analog's editor, Paul Buckley questions Heinz-Peter Beckemeyer, TI's EMEA Director Analog Marketing and Paul McCormack, TI's Business Development Manager for ...
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