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Bosch acknowledges ASE's help with accelerometer

August 26, 2014 | Peter Clarke | 222906631
Bosch acknowledges ASE's help with accelerometer Consumer MEMS provider Bosch Sensortec GmbH has acknowledged that assembly and test services provider Advanced Semiconductor Engineering, Inc. (Taipei, Taiwan) helped it produce the industry's smallest 3-axis MEMS accelerometer available in the market today.

Bosch originally announced the BMA355 in a package measuring 1.5mm by 1.2mm by 0.8mm in January 2013 (see BMA355 accelerometer measures only 1.2mm by 1.5mm by 0.8mm). The conventional footprint for such accelerometers was and remains 2mm by 2mm (see Sensor footprint evolution: Does size matter?). Market analysis company Yole Developpement has published a chart tracking 3-axis accelerometer size evolution that shows that the BMA 355 WLCSP 3-axis accelerometer from Bosch is the smallest device on the market at only 1.4 cubic millimeters (see Yole compares smallest 3-axis accelerometers).

Advanced Semiconductor Engineering (ASE) said that its contribution to the BMA355 was the advanced wafer level chip scale package (WLCSP) used for the accelerometer. In statement issued by ASE, Wolfgang Lohner, CFO of Bosch Sensortec, said that ASE delivered both technology and manufacturing capability to help Bosch succeed.

"Semiconductor industry trends towards smaller and thinner form factors is providing major impetus for ASE to explore and develop unique packaging techniques using innovative material and process technologies," said Fuyu Shih, vice president of sales and marketing in Europe for ASE, in a statement. "Our partnership with Bosch Sensortec encompassed key strategic collaboration on advanced technologies involving both WLCSP and TSV."

Related links and articles:

News articles:

BMA355 accelerometer measures only 1.2mm by 1.5mm by 0.8mm

Sensor footprint evolution: Does size matter?

Yole compares smallest 3-axis accelerometers

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