December 13, 2011 Lattice Semiconductor Corporation has released version 6.2 of its PAC-Designer mixed signal design software, with updated support for Lattice’s Platform Manager, Power Manager II and ispClock devices. Users designing with Platform Manager devices now have more integrated access to the Lattice Diamond 1.4 software design environment, also announced today. Read more

December 12, 2011 Lattice Semiconductor Corporation has entered into a definitive agreement to acquire SiliconBlue Technologies, a pioneer in Custom Mobile Device solutions for the consumer handheld market. Utilizing a single chip, ultra-low power Field Programmable Gate Array (FPGA) fabric, SiliconBlue's mobileFPGA devices enable mobile designers to quickly add features to their mobile platform in areas such as connectivity, memory / storage, sensor management, and video / imaging. Read more

October 31, 2011 Lattice Semiconductor Corporation and Valens Semiconductor have developed a new and comprehensive HDBaseT camera reference design solution.  The HDBaseT reference design is targeted at the surveillance market.  Read more

October 17, 2011 Lattice Semiconductor Corporation has introduced its ispLEVER Classic version 1.5 design tool suite which continues to support the ultra-low power ispMACH 4000ZE CPLD family as well as all of Lattice's mature programmable devices, including GAL and ispGAL Simple PLDs (SPLDs); ispLSI, MACH, ispMACH and ispXPLD Complex PLDs (CPLDs); ORCA, FPSC and ispXPGA Field Programmable Gate Arrays (FPGAs); and ispGDX/ispGDX2 crosspoint devices. Read more

September 12, 2011 Lattice Semiconductor Corporation plans to launch the worldwide Power 2 You Seminar Series in October 2011.  The seminar will include comprehensive practical and technical presentations that combine basic design principles, advanced programmable power and platform management concepts, and real-world power and platform management application examples. Read more

September 6, 2011 Lattice Semiconductor Corporation has begun shipping samples of the company’s MachXO2 PLD family using a 2.5 mm x 2.5 mm 25-ball Wafer Level Chip Scale Package (WLCSP). The MachXO2 devices now claim to combine a small footprint with the industry’s lowest power and most feature rich low density PLDs. Read more

July 18, 2011 Lattice Semiconductor Corporation has release 1.3 of its Lattice Diamond design software, the flagship design environment for Lattice FPGA products. Users of Lattice Diamond 1.3 software will benefit from major new features, including clock jitter analysis. Lattice Diamond 1.3 software is also now integrated with Lattice's PAC-Designer 6.1 mixed signal design tools which provide design support for Lattice's programmable mixed signal Platform Manager devices. Read more

July 18, 2011 Lattice Semiconductor Corporation has released 6.1 of its PAC-Designer mixed signal design software, with updated support for Lattice's Platform Manager, Power Manager II and ispClock devices. Users designing with Platform Manager devices will now have access to the Lattice Diamond 1.3 software design environment. Read more

July 6, 2011 Lattice Semiconductor’s LatticeECP3 FPGA family is compliant with the PCI Express 2.0 specification at 2.5 Gbps. The LatticeECP3 FPGA and its PCI Express (PCIe) IP core passed PCI-SIG PCIe v2.0 compliance and interoperability testing for 1- and 4-lane configurations at a recent PCI-SIG workshop, ensuring that Lattice’s solution is interoperable with existing PCIe 2.0 supported systems. Read more

June 14, 2011 Lattice Semiconductor Corporation and Flexibilis Oy have announced the immediate availability of the Flexibilis Ethernet Switch (FES) IP core.  The triple speed (10 Mbps/100 Mbps/1 Gbps) FES IP cores operate on Ethernet Layer 2 and can switch with gigabit forwarding capacity per port.  Read more

May 31, 2011 Lattice Semiconductor Corporation has signed a global distribution agreement with Digi-Key Corporation which authorizes Digi-Key to sell Lattice's complete portfolio of innovative low power, low cost FPGA, PLD and programmable power management design solutions. Read more

May 16, 2011 Lattice Semiconductor Corporation and System General, a leading provider of device programming instruments, have announced that both automated and manual programming systems now fully support the first member of the MachXO2 PLD family, the 1200 LUT LCMXO2-1200. Read more

May 3, 2011 Lattice Semiconductor and Oregano Systems Design & Consulting announced the immediate availability of three comprehensive versions of the IEEE-1588 Timing Node System IP core for the LatticeECP3 and LatticeECP2M FPGA families. These SoC-class versions of the IP core are characterized by different levels of functionality and performance. Read more

May 2, 2011 Lattice Semiconductor Corporation has unveiled a 4 x 3.125Gbps version of the Serial RapidIO 2.1, Level 1 endpoint core utilizing the award winning LatticeECP3 FPGA family. The device is an extension of the SRIO v2.1 core that originally supported 1x and 2x up to 3.125 Gbps and 4x up to 2.5 Gbps. Read more

April 26, 2011 Lattice Semiconductor Corporation has introduced the company’s new $29 MachXO2 Pico Development Kit for prototyping low power, space constrained consumer designs. Built on a low power 65-nm process featuring embedded Flash technology, MachXO2 devices provide designers of low density PLDs a mix of low cost, low power and high system integration in a single device. Read more

April 18, 2011 Lattice Semiconductor Corporation has unveiled release 1.2 of the company’s Lattice Diamond FPGA design software tool suite. Users of the new MachXO2 PLD devices can now generate complete systems based on the LatticeMico8 open source 8-bit controller core using the LatticeMico System tool, which is available with the Lattice Diamond design environment. Read more

April 5, 2011 Lattice Semiconductor Corporation is offering full support for Aptina's High-Speed Serial Pixel Interface (HiSPi) using LatticeXP2 FPGAs.  The LatticeXP2 HiSPi bridge reference design allows any Image Signal Processor (ISP) with a traditional CMOS parallel bus to interface with an Aptina HiSPi CMOS sensor. Read more

March 28, 2011 Lattice Semiconductor Corporation has partnered Helion Technology to provide a portfolio of Compression and Encryption IP cores for the LatticeECP3 FPGA family. The portfolio features a Payload Compression System core that enables improved utilization of constrained channel bandwidth, making it ideal for use in Microwave Backhaul applications, Broadband Wireless Access for 802.16e (WiMAX), and, potentially, other Multi-Link Multi-In Multi-Out (MIMO) applications. Read more

March 28, 2011 Lattice Semiconductor Corporation is releasing three new low-cost I/O Breakout Boards: the MachXO 2280 Breakout Board, the ispMACH 4256ZE Breakout Board and the Power Manager II POWR1014A Breakout Board. Read more

March 15, 2011 Thruput Ltd has chosen Lattice Semiconductor's LatticeXP2 FPGAs for use in MIDAS, the first low-power, lossless real time video processing platform. Boasting an impressive eight dual-link inputs and driving up to three full resolution monitors, the Thruput MIDAS delivers over two billion pixels per second of silent processing power. Read more

March 2, 2011 Lattice Semiconductor Corporation has released the Lattice HDR-60 Video Camera Development Kit, a production-ready High Definition (HD) video camera development system based on the LatticeECP3 FPGA family. Read more

February 7, 2011 Lattice Semiconductor Corporation has unveiled five new comprehensive Intellectual Property (IP) Suites to accelerate the design of electronic systems in a variety of industries using the LatticeECP3 FPGA family. The five IP suites are PCI Express, Ethernet Networking, Digital Signal Processing, Video & Display, and Value. Read more

November 29, 2010 Lattice Semiconductor Corporation has added the HiGig MAC IP core to low cost LatticeECP3 FPGA family. Multiple individual devices interconnected via the HiGig protocol operate as one logical network, seamlessly providing features like quality of service (QoS), mirroring and link aggregation. Read more

November 8, 2010 Lattice Semiconductor Corporation has released Version 1.1 of the company’s Lattice Diamond FPGA design software, the flagship design environment for Lattice FPGA products. The update includes support for the new MachXO2 PLD family, completion of support for the LatticeECP3 FPGA family, and the initial release of Lattice’s own synthesis engine with support for the MachXO and MachXO2 product families. Read more

November 2, 2010 Lattice Semiconductor Corporation is announcing the immediate availability of the PCI Express Root Complex (RC) Lite solution based on the LatticeECP3 and LatticeECP2M FPGA families for use in simple bridging application to any legacy host bus. Using a low cost programmable FPGA platform, designers can implement the specific bridge function that matches the interface available on their particular host CPU. Read more

October 12, 2010 Lattice Semiconductor Corporation has unveiled its third-generation mixed-signal devices, the Platform Manager family. The programmable Platform Manager devices aim to simplify board management design by integrating programmable analog and logic to support many common functions, such as power management, digital housekeeping and glue logic. Read more

September 20, 2010 Lattice Semiconductor Corporation has introduced the company's full rate SPI-4.2 solution based on a low cost, low power FPGA fabric.  Read more

August 16, 2010 Lattice Semiconductor Corporation has introduced Version 1.4 of its ispLEVER Classic design tool suite. The ispLEVER Classic design software has been upgraded with the addition of Synopsys Synplify Pro with the HDL Analyst feature set, and an improved ispMACH 4000ZE CPLD fitter with improved power optimization. Read more

July 19, 2010 Lattice Semiconductor Corporation has released more than 90 reference designs optimized for the MachXO and ispMACH 4000ZE PLDs. Read more

July 6, 2010 Lattice Semiconductor and Helion GmbH have released Intellectual Property (IP) cores for the video security and surveillance camera market. Targeting the LatticeXP2, LatticeECP2M and LatticeECP3 FPGA families, Helion has demonstrated its IONOS video pipeline IP and Vesta evaluation platform. Read more

June 29, 2010 Lattice Semiconductor Corporation has partnered with Affarii Technologies to successfully demonstrate the industry’s lowest cost, low power Remote Radio Head (RRH) solution at 1300 mW per antenna. Read more

June 7, 2010 Lattice Semiconductor Corporation has unveiled a new versatile LatticeXP2 Brevia Development Kit and 28 new silicon-proven reference designs, which are ideal for developing high volume, cost sensitive, high density applications. Read more

June 1, 2010 Lattice Semiconductor Corporation has added a new, higher performance device to its second generation Power Manager II product family. Read more

May 20, 2010 NXP Semiconductors is developing two boards designed to demonstrate the interoperability of its CGV JESD204A-compliant high speed data converter family with Lattice Semiconductor's ECP3 FPGA family. Read more

May 12, 2010 Lattice Semiconductor Corporation is planning to interoperate between Cavium Networks' OCTEON II CN63XX processors and the LatticeECP3 FPGA family via a Serial Rapid IO (SRIO) Specification 2.1 link.  Read more

April 12, 2010 With the launch of its low cost PCI Express development kit, Lattice Semiconductor claims that users can typically achieve working PCI Express hardware in thirty minutes, based on the LatticeECP3 family of low power FPGAs. Read more

April 8, 2010 Nu Horizons Electronics Corp., is to distribute the full range of Lattice Semiconductor products on a global basis. Read more

April 6, 2010 Lattice Semiconductor Corporation has introduced Service Pack 1 for Version 8.0 of its ispLEVER FPGA design tool suite. Read more