April 24, 2012 Movea has revealed the company's Chemistry of Motion solution that enables the company to rapidly prototype new motion features for customers in the mobile, Interactive TV, sports, and health markets.  Read more

April 20, 2012 Integrated Device Technology, Inc. has introduced a new family of precision temperature sensors targeted at ultra-low-power solid state drive applications. Read more

March 26, 2012 As more and more MEMS sensors are showing up in mobile devices, the focus of MEMS design has begun shifting from discrete MEMS components to MEMS sensor data integration. Read more

March 6, 2012 Seiko Instruments Inc. has developed its S-5716 Hall-IC Series in CMOS technology to provide precise magnetic sensors using the Hall-effect to detect omnipolar N- and S-pole or unipolar either N- or S-pole magnetic flux. Read more

February 29, 2012 Honeywell's RTY Series hall-effect rotary position sensors provide non-contact operation and low torque actuation which reduces worn-out mechanisms and provides a minimum 12M cycle product life. The sensor’s IP67-sealed package has an integral connector. The integrated reverse polarity protection provides protection against installation errors. Read more

February 28, 2012 Microchip Technology Inc., has announced at the Embedded World Conference in Germany a new series of low pin count 32-bit PIC32 microcontrollers (MCUs) that provide 61 DMIPS of performance in packages as small as 5 mm x 5 mm, for space-constrained and cost-sensitive designs. Read more

February 27, 2012 Posifa Microsystems, Inc., has unveiled a new line of improved Mass Air Flow Sensors. The PMFc3000 family, which is a pin compatible upgrade to the Honeywell AWM3000 series, incorporates the latest MEMS and microelectronics innovations. By replacing the common 'membrane-cavity' structure with a proprietary 'solid-state' thermal isolation process, Posifa’s sensors bring new levels of reliability to applications to eliminate field failures associated with pressure shock and contamination. Read more

February 23, 2012 Europe's leading organic and large-area electronics (OLAE) organizations have joined forces in the Framework 7 project COLAE, which aims to speed up the commercialization and adoption of organic and large area electronics by promoting collaboration between industry clusters throughout Europe. COLAE will utilize the resources and know-how of the project partners to provide tools and services for the existing organic electronics industry, as well as supporting the entry of new players. Read more

February 22, 2012 Thermal diffusivity based sensors are the future, according to professor Kofi Makinwa of Delft University of Technology, speaking at the International Solid States Circuits Conference on Monday (February 20). Read more

February 8, 2012 Microsemi Corporation is participating in a multi-disciplinary consortium tasked with developing innovative CMOS-compatible, high-temperature sensors that help reduce carbon emissions and drive energy consumption savings. The European Union's Seventh Framework Programme (FP7ICT) is funding the majority of the SOI-HITS (Silicon on Insulator High Temperature Systems) project, which is slated for completion by the end of August 2014. Read more

February 7, 2012 The reduction of CO2 emissions is the long-term goal of the research project SOI-HITS (Silicon on Insulator - High Temperature Systems). The project's contribution to this goal is developing CMOS-compatible high-temperature sensors for use in automotive combustion systems as well as in domestic or industrial boilers. Read more

January 26, 2012 Researchers at City University London and Queen's University Belfast following several research projects funded by the Engineering and Physical Sciences Research Council (EPSRC) have developed innovative sensors that they claim will dramatically improve the ability to spot early warning signs of corrosion in concrete. Read more

January 25, 2012 Cal Sensors has launched of a sensor prototype kit designed as a plug-and-play tool that will dramatically accelerate prototyping, validation and product development for new gas measurement instruments. Supporting PbS and PbSe detector technologies, the prototype kit allows engineers to focus on the challenges of the system’s design by quickly validating detector viability. Read more

January 17, 2012 Baolab Microsystems SL (Barcelona, Spain) a startup pioneering the creation of microelectromechancial systems (MEMS) within the metal interconnect layers of CMOS wafers, has announced that will offer evaluation kits for its tri-axis compass by the end of February 2012. Read more

December 16, 2011 Researchers at Rochester Institute of Technology and PPC Corp., have developed a “Smart Connector” sensor to automatically detect equipment damage and pinpoint its exact location using self-diagnostics. Read more

December 15, 2011 Switching to a new formulation of cabon nanotube ink can enable the fabrication of smart devices that are flexible, fast, cheap and extremely durable, according to new results at the U.S. Department of Energy's Lawrence Berkeley National Laboratory. Read more

December 14, 2011 austriamicrosystems has revealed that the company is supplying high volumes of intelligent ambient light and proximity sensors into four Samsung Galaxy models. Read more

December 14, 2011 API Technologies Corp. has introduced a new output option for the company’s Spectrum Sensors line of H009 Hall Effect Position Sensors. The new 4-20 mA output option joins the existing H009 series with Analog, PWR, and Serial output options. Read more

December 12, 2011 STMicroelectronics has expanded its motion-sensing portfolio with the addition of the market’s smallest three-axis digital-output gyroscope. ST’s L3G3200D enables advanced motion sensing in ever-shrinking form factors of next-generation mobile phones, tablets and other smart consumer devices, by reducing the package size by almost half over current-generation sensors. Read more

December 5, 2011 Scientists at the University of Limoges have shown that it is possible to simultaneously create highly reproductive three-dimensional silicon oxide nanodots on micrometric scale silicon films in only a few seconds. The technology will enable new methods for creating 3D nanostructures deposited on an array of regularly spaced indentations on the surface of silicon films which will open the door for innovative nanosensors. Read more

December 2, 2011 STMicroelectronics has introduced ultra-low-power, high-performance three-axis accelerometers in 2x2 mm packages. Reducing the size by a factor of 2 over current-generation devices, ST’s newest acceleration-sensor family is suitable for motion-sensing features in power- and space-constrained consumer applications, such as mobile phones, tablets and gaming controls. Read more

December 1, 2011 Revenue derived from the use of magnetic sensors in automotive motors will expand by nearly 40 percent in 2012 reaching $160.3 million, according to market research firm IHS iSuppli. Read more

November 17, 2011 TAOS has extended the company’s product portfolio with the industry’s first color sensors with an on-chip infrared (IR) blocking filter and proximity sensor. Read more

November 8, 2011 Global distributor, Mouser Electronics , Inc, has agreed an exclusive global distribution partnership with Azoteq , a world leader in proximity and touch solutions designed to supplant costlier sensor, switch, slider, scroll wheel and touch interface design options in consumer, medical and industrial applications. Read more

November 4, 2011 Freescale Semiconductor is offering a family of automotive acceleration sensors designed to speed the development of advanced airbag systems that help save lives and protect against injuries caused by vehicle collisions. Freescale's new Xtrinsic MMA65xxKW family of accelerometers employs intelligent sensing technologies designed for front and side crash detection that can be easily and efficiently integrated into vehicle airbag systems. Read more

October 27, 2011 The platform is capable of sensing the flow of Bluetooth devices in a given street, roadway or passageway while differentiating hands-free car kits from pedestrian phones. Sensor data is then transferred by a multi-hop ZigBee radio, via an internet gateway, to a server. The traffic measurements can then be analysed to address congestion of either vehicle or pedestrian traffic. Read more

October 24, 2011 Macro Sensors announced a complete “out-of-the-box” solution for linear position gaging with its Eazy-gage bundle. Combining spring-loaded, AC-operated LVDT position sensors with an Eazy-cal mini-module LVDT signal conditioner, the Eazy-gage bundle takes the guess work out of gaging applications by providing a fully calibrated and complete linear position gaging system ready for immediate operation. Read more

October 20, 2011 A glass stamp approach similar to nanoimprint lithography and using glass instead of polymer may help researchers clear a large hurdle in scaling up lab-on-a-chip manufacturing. Read more

October 17, 2011 Japanese passives to power supplies giant Murata Manufacturing Co. Ltd., has announced it has agreed to buy VTI Technologies Oy (Vantaa, Finland) for about 20 billion yen (about 190 million euro or $260 million) in cash. Read more

October 12, 2011 Ziptronix, Inc. recently licensed its ZiBond technology to Sony Corp. providing its oxide bonding technology for backside illumination imaging sensors.The Morrisvile, N.C., company  has an extensive worldwide patent portfolio covering the fundamental concepts behind economical low-temperature oxide bonding and oxide bonding with interconnect. Read more

October 10, 2011 Commercial samples of Plessey Semiconductors' Electric Potential Integrated Circuit (EPIC) sensors are now available. The first products are optimized for use as an ECG sensor and claim to provide a resolution as good as or better than conventional electrodes. Read more

October 7, 2011 Intersil Corporation has introduced the ISL26132 and ISL26134, 24-bit delta-sigma ADCs containing an ultra-low noise programmable gain amplifier (PGA) with gains of 1x, 2x, 64x and 128x. Designed for weigh scales, precision sensors and industrial process control systems, the new ADCs provide direct connection to sensors without the need for additional circuitry. Read more

October 4, 2011 EM Microelectronic, the semiconductor company of the Swatch Group, has announced at the Bluetooth Technology Conference 2011 in Munich, Germany, the Bluetooth V4.0 qualification of its EM9301, the latest member of the company’s CoolRF circuits family. Read more

October 3, 2011 Premo has introduced a new series of Hall Effect sensors which have been designed for a double supply voltage of ±12 to ±18 Vdc. Read more

September 27, 2011 Texas Instruments Incorporated has introduced new sub-1 GHz 6LoWPAN solutions, aimed at providing a gateway for remote, low-cost wireless sensors to connect to the Internet and a wireless extension of wired IPv6 infrastructures. By operating in the sub-1GHz band, TI’s 6LoWPAN solutions offer longer wireless range at lower power levels than traditional 2.4 GHz-based 6LoWPAN offerings. Read more

September 26, 2011 Currently, more than 30 percent of knee replacement surgeries suffer from misalignment problems caused by the "fog of surgery"–where the precise orientation of internal bones is difficult to determine. By adding a complement of Analog Devices' high-precision MEMS sensors to track the alignment and motion of a patient's knee just moments before the surgery, OrthAllign Inc., (Aliso Viejo,CA) aims to up alignment success rate to 100 percent. Read more

September 22, 2011 As MEMS enters the mainstream, the high-volume markets will favor mergers and acquisitions over the next five years, as the larger player fill in the gaps of their integrated solution for OEMs, who must fuse the outputs of multiple MEMS sensors for a wider variety of applications than just tablets and phones. Read more

September 15, 2011 STMicroelectronics introduced its iNEMO Engine Sensor Fusion Suite, a new family of advanced filtering and predictive software that uses sophisticated algorithms to integrate outputs from multiple MEMS sensors. Real-time on-board motion-sensor data fusion is set to dramatically improve the user experience, increasing accuracy, resolution, stability and response time in advanced motion-based applications in consumer, computer, industrial and medical fields. Read more

September 14, 2011 From one chip and a variable input voltage of 4 V to 36 V iC-Haus GmbH's iC-DC generates two stabilized output voltages that can be adjusted between 1.5 V and 5.5 V for the compact voltage supply of industrial sensors and small subsystems. Read more

September 13, 2011 Dialog Semiconductor plc has introduced what the company claims is the world’s first family of IC based devices interoperable with the DECT ULE (ultra low energy) wireless standard. SmartPulse has been created for home automation, healthcare, security and energy monitoring consumer applications. Read more

September 12, 2011 Lifted by the strong automotive sector and rising global demand for digital compasses in smartphones and tablets, the market for silicon magnetic sensors is enjoying accelerated growth, with revenue in 2011 set to rise a strong 23.7 percent, according to a new IHS iSuppli MEMS & Sensors Special Report from information and analysis provider IHS. Read more

September 6, 2011 ULIS, a manufacturer of high-quality infrared imaging sensors for thermography, security, automotive and military applications is to collaborate with CEA/Leti, a leading international technology research centre, in a project to develop and market a new line of infrared (IR) sensors. Read more

September 1, 2011 Farnell has launched a new microsite dedicated to sensors and sensing applications. In addition to giving fast and easy access to over 4,000 products, the sensing microsite also provides extensive design resources including application notes, white papers and product training videos to help keep engineers involved in this rapidly evolving sector up-to-date with the latest technologies and methodologies. Read more

August 18, 2011 With the emission limits in exhaust legislation becoming ever stricter, exhaust sensors are becoming increasingly important. At the same time, automakers are becoming increasingly demanding with respect to sensors' installation space, measurement accuracy, and robustness. For this reason, Bosch is now launching the LSF Xfour, the successor generation of the tried and true LSF4.2 switching-type lambda sensor. The new sensor is smaller and more robust, and its measurement accuracy has been improved. In addition, it responds faster following a cold start. Read more

August 9, 2011 Intersil Corporation has extended its family of precision op amps, introducing a new 5 V, ultra-low noise, chopper-stabilized zero drift rail-to-rail amplifier featuring half the noise of competitive amps that consume similar power. Read more

August 5, 2011 The high speed G10768-1024D InGaAs linear image sensors and the C10854 multichannel detector head from Hamamatsu Photonics have been designed to meet increasing industrial requirements for the detection of foreign bodies on-line in the near infrared range (wavelength range from 800 nm to 1700 nm). Read more

August 3, 2011 Multitest has added a new application to its MEMS test and calibration product line.  With the new application, 3D earth magnetic field sensors can be used for innovative mobile applications and state-of-the-art navigation applications without the use of a GPS. Read more

July 27, 2011 NXP Semiconductors N. V. has release a new generation of automotive position sensors. The KMA210 incorporates NXP’s latest magnetoresistive sensor chip and a signal conditioning ASIC developed in NXP’s advanced Silicon on Insulator (SOI) ABCD9 process technology. The device is the first of a new magnetic sensor family in a full system-in-package solution that requires no external components. KMA210 is specially designed to improve the overall performance and increase robustness in automotive applications. Read more

July 20, 2011 Ferroelectric memories, energy harvesting arrays, sensors and actuators could soon be fabricated on plastic substrates, according to researchers at the Georgia Institute of Technology, who recently demonstrated a new low-temperature process using an atomic-force microscope (AFM). Read more

July 14, 2011 French distributor, Equipements Scientifiques (ES) has signed a new distribution agreement with Spain’s PREMO Group. Read more

July 13, 2011 Honeywell launched the TruStability NCS Series of uncompensated/unamplified board mount pressure sensors, offering customers the flexibility of self-calibration, combined with stability, accuracy and repeatability. The sensors deliver a ratiometric analog output for reading pressure over the specified full scale pressure span and temperature range. Because they are uncompensated and unamplified, they offer infinite resolution on the pressure signal. Read more

July 8, 2011 Toshiba Electronics Europe has launched a 1.12 micrometre pixel CMOS image sensor, combining the industry's smallest level pixel size with the enhanced sensitivity and improved imaging performance of back-side illumination technology (BSI). BSI sensors deploy lenses on the rear of the sensor - on the silicon substrate – rather than the front, where wiring limits light absorption. Read more

July 7, 2011 Spectrum Sensors & Controls has introduced a line of quick-ship analog accelerometers available in customer-specified configurations and fully calibrated. New XL403A accelerometers enable test engineers to quickly get a rugged, precision accelerometer configured to deliver proper measurements in a project. Single, dual and triaxial versions are available in any full-scale range from ±1 g to ±15 g, with bandwidths up to 800 Hz. Read more

July 1, 2011 Premo has introduced a new series of Hall Effect sensors designed for a single supply voltage of +5V. The DSR5 family is a close loop technology component in a small package for THT mounting. Primary winding is already integrated to enable measurement of DC, AC and pulse currents on printed circuit boards. Read more

June 23, 2011 Sensortechnics' new KMA series measures gage pressures of corrosive and aggressive gases and liquids in ranges from 500 mbar to 100 bar. These pressure sensors use internal digital signal conditioning to deliver calibrated and temperature compensated 0.5 to 4.5 V output signals. The KMA sensors are based on very accurate and long-term stable ceramic pressure cells with excellent media compatibility. Read more

June 22, 2011 The global semiconductor market will be $315 billion in 2011, an increase of 5.1 percent on 2010, according to market research firm Gartner Inc. This is down from Gartner's previous forecast, given in the first quarter, for 6.2 percent growth this year. Read more

June 16, 2011 austriamicrosystems AG has entered into an agreement with Texas Advanced Optoelectronic Solutions, Inc. (TAOS), headquartered in Plano, Texas (USA), to acquire 100% of the shares in TAOS. The transaction is expected to close within the next eight weeks subject to certain regulatory approvals and the occurrence of certain conditions defined in the agreements with the sellers of the TAOS shares. Read more

June 15, 2011 The Sensors Xplained software framework announced by Atmel is aimed at accelerating the development of sensor-based devices and applications by providing driver and calibration support for a variety of the most popular sensor types used in consumer, industrial and medical applications. Read more

June 14, 2011 For use in low voltage single- and three-phase brushless DC (BLDC) motor control applications, the DMC4040SSD complementary dual MOSFET from Diodes Incorporated features matched N-channel and P-channel Rds(on) performances to ensure DC losses in motor loads are balanced and minimized. Read more

June 7, 2011 Murata launched the IRS-B series of dual and quad type surface mount pyro-electric infrared sensors. It is the smallest PIR sensors in the world, but also the only surface mount devices available, claims the manufacturer with three models, IRS-B210ST01, IRS-B340ST02 and IRS-B345ST03 measuring only 4.7x4.7x2.4mm. Read more

June 1, 2011 Plessey Semiconductors plans to demonstrate the company’s Electric Potential Integrated Circuit (EPIC) sensor technology at Sensors Expo (Chicago, USA June 6-8 2011). The EPIC sensor claims to represent a new area of sensor technology that measures changes in an electric field in a similar way to a magnetometer detecting changes in a magnetic field. Read more

May 19, 2011 Silicon Frontline Technology, Inc. (SFT) is introducing what the EDA company claims is the industry’s first commercial hierarchical 3D extractor, H3D, for post-layout verification. H3D offers hierarchical parasitic extraction, hierarchical netlisting, unlimited capacity, and field-solver accuracy. H3D works with design flows from the leading EDA suppliers. Read more

May 16, 2011 Touch sensor specialist Zytronic is launching a new range of its ZYBRID sensors employing deposited tracks of transparent Indium Tin Oxide (ITO) as the sensing medium to complement the present product sensor range which utilizes copper strand electrodes. The sensors claim to deliver benefits compared with other currently available ITO-based mutual capacitive type pro-cap offerings, particularly for smaller, ruggedized touch devices. Read more

May 16, 2011 Beginning in 2011 CMOS image sensor sales are expected to gain momentum and consistency with 13 percent growth in 2011 to a new record high of $5.1 billion, topping the previous peak of $4.6 billion set in 2008, according to market research company IC Insights. Read more

May 12, 2011 The Global Semiconductor Alliance (GSA) industry body has announced that is has agreed to form an "organizational alliance" with the MEMS Industry Group trade association. Read more

May 12, 2011 With its Light Curtains Pick to Light, sensor producer Wenglor extends its portfolio of photoelectronic sensors, following the "Pick to Light" principle whereby the light curtains monitor the correct parts picking processes in shelves and storage locations during mounting and commissioning and thus effectively prevent errors. Read more

May 11, 2011 The Eazy-Cal from Macro Sensors is what the company claims to be the most user-friendly LVDT signal conditioner. Employing a virtually effortless fingertip calibration routine, the Eazy-Cal MMX series saves time and money by eliminating the repetitive null and span potentiometer adjustments associated with conventional analog based signal conditioners. Read more

May 3, 2011 The multi-purpose signal conditioners Models 482C27 and 483C28 from PCB Piezotronics are designed for use with a large variety of sensor types including differential MEMS, single-ended MEMS, bridge, and ICP sensors. Read more

May 3, 2011 The EnOcean Alliance, a consortium of companies working to standardize and internationalize energy harvesting wireless technology for green intelligent buildings, has declared that its wireless, battery-less energy harvesting sensors and associated control systems are now fully interoperable with TCP/IP. Read more

May 2, 2011 Apple Inc., in 2010 rose one rank to become the world's second largest buyer of microelectromechanical system (MEMS) sensors for consumer electronics products and cell phones, as it snapped up parts for products including the iPhone 4 and iPod Touch, new IHS iSuppli research indicates. Read more

April 28, 2011 The EK-P3 evaluation kit from Sensirion offers a straightforward and cost-effective option for testing the company's SDP600 series of digital differential pressure sensors. The set consists of a USB stick that is connected to the SDP610 sensor by an adapter cable. Read more

April 1, 2011 RM Ingénierie, a subsidiary of the CEGEDIM Group, is using Movea’s miniaturized MotionPod , Inertial Measurement Unit (IMU) to enable a new generation of groundbreaking joint assessment and rehabilitation applications. Read more

March 31, 2011 Hewlett-Packard has officially opened a new data center Wednesday March 30 that will both help run its internal business and act as a lab to research techniques to reduce consumption of energy in data centers. To that end, the building has been outfitted with nearly 10,000 networked sensors. Read more

March 30, 2011 austriamicrosystems is conditionally releasing for volume production the company’s advanced 0.18 µm High-Voltage CMOS process technology "H18” which will be manufactured in IBM’s 200 mm Burlington wafer facility. Jointly developed with IBM, the 0.18 µm High-Voltage CMOS process is the 6th generation of continuously improved High-Voltage CMOS technologies developed at austriamicrosystems. Read more

March 30, 2011 Scientists at SINTEF are collaborating with colleagues from universities in Norway, other European countries and the USA to perfect the fabrication of 3D radiation sensors. The special sensors will be needed when CERN’s 30-km particle collider ring in Switzerland is upgraded to run at higher energies in 2017. Read more

March 9, 2011 In this news analysis article EE Times Europe Analog's editor, Paul Buckley, discusses the development of the new iMEMS gyroscopes launched by Analog Devices Inc., with Wayne Meyer, ADI's Marketing & Applications Manager MEMS and Sensor Technologies Division. Read more

March 2, 2011 Wireless sensors are bringing greater control and energy efficiency to the Building Automation Systems (BAS) market with adoption growing during the second half of 2010. Concerns over energy efficiency have long driven interest in new technologies to better manage energy use, and are driving interest and investment in wireless-enabled building environment controls. Read more

February 28, 2011 ON Semiconductor has completed the acquisition of the CMOS Image Sensor Business Unit (ISBU) from Cypress Semiconductor in an all cash transaction for approximately $31.4 million, subject to adjustment under the purchase agreement. The purchase price was approximately 1x annual sales for the division. Read more

February 23, 2011 The inertial sensor market for consumer electronics is growing very quickly due to the fast adoption of accelerometers, gyroscopes and magnetometers in mobile phones, tablets, game stations and laptops….Indeed, according to Laurent Robin, analyst for the MEMS & Sensors market at Yole Développement, 20.3% annual growth is expected from $847M in 2009 to reach $2.56B in 2015. Read more

February 16, 2011 Banner Engineering introduced the iVu Plus, adding Ethernet connectivity and more advanced inspection capabilities to the iVu's intuitive platform. Ethernet connectivity enables iVu Plus sensors to share inspection data directly with PLCs, PCs or other factory devices, making communications and control even easier on the plant floor. The iVu Plus is also capable of storing up to 30 inspections, accommodating rapid product changeover, while a new sort sensor function facilitates sorting of as many as 10 patterns in a single inspection. Read more

February 9, 2011 Researchers at the Birck Nanotechnology Center, Purdue University, are developing a new type of biological and chemical sensor that has few moving parts, is low-cost and yet highly sensitive, sturdy and long-lasting. The "diffraction-based" sensors are made of thin stripes of a gelatinous material called a hydrogel, which expands and contracts depending on the acidity of its environment. Read more

January 27, 2011 Baumer launches a new generation of magnetic cylinder sensors for detecting the exact position of pistons in pneumatic cylinders. The new cylinder sensors available for T und C slots have been enhanced in performance and reliability. Read more

January 21, 2011 Foundry chipmaker United Microelectronics Corp. has started producing microelectromechanical systems (MEMS) sensor products for customers and has volume production scheduled for later this year. The achievement follows three years of MEMS technology development. UMC said. Read more

January 14, 2011 Rohde & Schwarz is expanding its portfolio of USB-capable power sensors with the new R&S NRP Z85 and R&S NRP Z86, claimed to be the world's first wideband sensors to measure power from 50 MHz to 40 GHz without requiring a base unit. Instead of a base unit, the sensors are connected to a PC via a USB interface. This cost-efficient solution displays envelope power over a dynamic range of 47dBm to +20dBm, which is unprecedented in the industry according to the manufacturer. Read more

January 11, 2011 Volkswagen AG Business Unit Braunschweig plans to use Infineon's Hall sensors in its electric power steering systems for vehicles. Infineon’s TLE4998C4 programmable linear Hall sensor will be used for various model ranges. Infineon has already started to deliver the chips. Read more

January 11, 2011 Analog Devices, Inc., is aiming to help engineers keep pace with the rapidly evolving industry by expanding its online educational offerings to include a new series for engineers seeking a better understanding of the basics of signal processing design essentials. The monthly "Fundamentals of Designing with Semiconductors for Signal Processing Applications" webcast series premieres on January 12 with ‘Sensors and How to Use Them’, presented by David Kress, a veteran analog applications engineer and currently the director of technical marketing for ADI. Read more

December 14, 2010 Singapore's Institute of Microelectronics (IME) will collaborate with the University of Illinois at Urbana-Champaign to explore new ways to design and make nanowire sensors. Their goal is to create commercial sensors that could eventually be used in point-of-care test systems to detect proteins that signal cancer. Read more

November 25, 2010 Driven by the sharp rebound in the automotive production and inventory rebuilding, the market for automotive microelectromechanical system (MEMS) sensors will grow to record size in 2010, according to market research firm iSuppli. Read more

November 22, 2010 austriamicrosystems' Full Service Foundry business unit is expanding the company's fast and cost-efficient ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with a more extensive schedule in 2011. The service, which combines several designs from different customers onto one wafer offers cost benefits for foundry customers becuase the costs for wafer and masks are shared among a number of different shuttle participants. Read more

November 11, 2010 Cypress Semiconductor Corp., is making two extensions to the company's VITA family of image sensors — the 2.3-megapixel VITA 2000 and the 5.3-megapixel VITA 5000.  The devices are ideal for machine vision, high-end security, 2D barcode and intelligent traffic applications. Read more

November 10, 2010 Pioneering wireless mind-control specialist, Emotiv, is employing Nordic Semiconductor's 2.4 GHz proprietary transceivers in the off-the-shelf EPOC Neuroheadset platform that Emotiv is now actively targeting at the mainstream consumer gaming industry. Read more

November 10, 2010 Zytronic launched the ZXY100/128 controller, capable of supporting touchscreens greater than 50 inches (127cm) across. Developed for the company's proprietary range of touch sensors, the ZXY100 touch controller board is supported by the same WHQL certified driver as the smaller controllers in the range, and offers features such as dual-touch output for linkage to “multi-touch” or gesture recognition software, Windows 7 plug and play, in-field firmware upgradeability and reduced PCB footprint. Read more

November 5, 2010 Renesas Electronics has introduced four 16-bit microcontroller (MCU) products that support slave device operation in the IO-Link communication standard for miniature sensors and actuators used in industrial systems. Read more

November 4, 2010 STMicroelectronics and Omron have collaborated to provide a complete solution for electronic gas meter flow sensors. The flow sensor they have developed is a key component for the smart turn-key gas meter solution that ST is developing. Read more

October 29, 2010 As the use of motion sensors in various consumer electronic devices is expanding quickly, the industry competitive landscape is significantly changing. In particular concerning MEMS gyroscopes. The battle to introduce the 3-axis gyroscopes on smartphones has just started, but the major market for MEMS gyroscopes is still gaming. In a $418M consumer gyroscope market in 2010, gaming represents a market segment of $162M according to Yole Développement. Read more

October 18, 2010 A high performance, synchronous boost converter that incorporates maximum power point control (MPPC) and starts up with inputs as low as 250 mV has been unveiled by Linear Technology. The LTC3105 operates over a wide input range of 0.2 V to 5 V, making it ideal for harvesting energy from high impedance alternative power sources, including photovoltaic cells, thermoelectric generators (TEGs) and fuel cells. Read more

October 18, 2010 Gleichmann Electronics is offering SensorDynamics' W6DoFIMU (Wireless 6 Degree of Freedom Inertial Measurement Unit) module which claims to be a complete solution for wireless acquisition and analysis of motion data within the smallest space. Read more

October 12, 2010 Silicon Laboratories Inc., has acquired Ireland-based ChipSensors Limited, an early stage technology company creating innovative single-chip CMOS sensors designed to detect temperature, humidity and gases. ChipSensors' technology complements Silicon Labs' touch, proximity sensing and recently acquired MEMS technology, expanding the company's capabilities in CMOS-based sensors. Read more

October 11, 2010 Building on its broad portfolio of DIN rail products, IMI Sensors released the model 682A16 universal transmitter for 24/7 vibration monitoring. Designed to protect plant and process machinery (including pumps, motors, fans and other critical rotating equipment) by providing crucial information that avoids costly downtime and increases productivity and profitability, the unit is suitable for vibration monitoring applications with IMI's 4-20 mA sensors or IMI's ICP accelerometers, and can be used with existing PLC, DCS, and SCADA systems leading to alarm, control, or shutdown. Read more

October 4, 2010 Sensirion has launched a filter cap for its latest generation of humidity sensors. The SF2 filter cap is made of PBT, has an integrated filter membrane, and protects Sensirion's SHT2x humidity and temperature sensor from water, dust, dirt and various contaminants. The filter cap features a filtration efficiency of 99.99% of all particles greater than 0.1µm and is designed to keep response time low. Read more

September 29, 2010 A team of McGill University researchers in Canada have now reported how to visualize and study the process of energy transport along one single conductive polymer molecule at a time. The new technique could become a key step towards bringing new applications to market based a wide range of products including TV displays, solar cells, and biomedical sensors. Read more

September 8, 2010 austriamicrosystems and electronic components distributor, Digi-Key Corporation have entered into an agreement in which Digi-Key will distribute austriamicrosystems products to customers worldwide. Read more

September 2, 2010 The OV2643 and OV2659 CMOS image sensors introduced by OmniVision Technologies are designed to address the increasing demand for 2-megapixel resolution cameras in the mid- to low-end feature phone segment, bringing high-definition (HD) video and excellent low-light sensitivity to this high-volume market. The chips offer advanced image signal processing and deliver 720p native HD video at 30 frames per second. Read more

August 17, 2010 Hewlett-Packard has developed a sensor platform that taps its experience as the largest supplier of the tiny mechanical structures in inkjet printheads. HP claims its MEMS process technology enables sensors a thousand times more sensitive than the models in use today, which were designed to trigger airbags during the violent motion of an automobile accident. Read more

July 6, 2010 Global shipments of automotive MEMS sensors will reach 591.2 million units in 2010, up 17.8 percent from 502.0 million, according to a forecast by market research firm iSuppli Corp. Read more

June 24, 2010 PREMO is enhancing its current sensors product range with the addition of new HCT-1000-SH series, a high current Closed Loop Hall Effect Sensor. Read more

June 22, 2010 Freescale Semiconductor Inc.'s new Xtrinsic family of smart MEMS sensors combine a 32-bit ColdFire microcontroller with on-chip algorithms for all the common operations like tap, touch, tilt and orientation, thereby streamlining designs and offloading the application processor. Read more

June 9, 2010 To help industrial equipment manufacturers more easily implement stabilization, navigation, and control features within their industrial system designs Analog Devices, Inc., is adding two highly integrated and precise MEMS inertial sensors to its product line of iSensor motion sensor products. Read more

June 8, 2010 Analog Devices, Inc., has introduced two fully calibrated, 16-bit-resolution, high-linearity digital temperature sensors that claim to achieve the industry’s highest level of precision over a wide operating temperature range. Read more

June 1, 2010 Maxim Integrated Products has introduced a security manager with 1024 bytes of nonimprinting memory to securely store sensitive data. Read more

May 26, 2010 French based MEMS technology consulting business, Yole Developpement, has published a market analysis report that forecasts the MEMS-based timing market will grow at a Compound Annual Growth Rate (CAGR) of 80 percent from 2010 to 2015. Read more

April 28, 2010 Silicon Laboratories Inc., has acquired Silicon Valley-based Silicon Clocks, an early stage company creating innovative microelectromechanical system (MEMS) technology. Read more

April 21, 2010 The maxon motor DEC module 50/5 controller is a digital amplifier with speed controller for controlling electronically commutated (brushless) DC motors with Hall sensors up to 250 watts. The plug-in module can be seamlessly integrated into complex applications with minimum effort, allowing customers to focus all their attention on developing their own equipment. Read more

March 30, 2010 PEWATRON (Zurich, Switzerland) has introduced its HJ-A series multifunctional current converters that offer a digital interface and take up little space on a mounting rail. Read more

March 26, 2010 Electronic components distributor, Digi-Key Corporation, has signed an agreement with Sanyo Semiconductor Corporation (USA) for global distribution. Read more

March 22, 2010 Just as photographic film was mostly replaced by silicon image chips, now quantum film threatens to replace the conventional CMOS image sensors in digital cameras. Made from materials similar to conventional film, a polymer with embedded particles, instead of silver grains like photographic film the embedded particles are quantum dots. Read more