March 5, 2012 MIPI Alliance has announced the Low Latency Interface (LLI) specification for mobile devices, which offers a point-to-point interconnect between the application processor and modem/baseband processor. Read more

February 29, 2012 Cypress Semiconductor Corp. has released an extension to Version 2.0 of the company’s PSoC Creator Design Environment for the PSoC 3 and PSoC 5 programmable system-on-chip families. Known as a 'Component Pack', the update includes new peripheral functions that customers can easily drop into existing PSoC devices to realize new capabilities within their designs. Read more

February 27, 2012 Mindspeed Technologies, Inc. and Contela, Inc. are to jointly develop advanced long-term evolution (LTE) femtocells and other small cell dual mode 3G/LTE solutions. The collaboration combines Mindspeed’s carrier-grade Transcede System-on-Chip (SoC) baseband processor solutions with Contela’s development expertise. Read more

February 22, 2012 Nordic Semiconductor ASA has released the company’s new µ Blue nRF8002 System-on-Chip (SoC) that provides a low cost, ultra-low power, easy to design-in single chip solution for Bluetooth Smart wireless tags and other accessories such as bracelets, pendants, keychains, small toys, and armbands. Read more

February 7, 2012 Samsung Electronics' Foundry business, Samsung Foundry, has collaborated with Cadence to develop a design-for-manufacturing (DFM) infrastructure to produce the most advanced chips. Working closely together, Cadence and Samsung Foundry have developed “in-design” and signoff DFM flows to tackle physical signoff and electrical variability optimization for 32-, 28- and 20-nanometer SoC designs. Read more

February 7, 2012 Maxim Integrated Products has introduced the 78M6631, a Teridian 3-phase power measurement system-on-chip (SoC) that embeds power monitoring into high-load applications. The fully self-contained and customizable energy measurement system offers a full range of measurement and diagnostics, and results in ease of design and reduced costs. Read more

February 3, 2012 X-FAB Silicon Foundries has used Silicon Frontline Technology, Inc’s R3D (Resistive 3D) software for X-FAB’s 0.18 micrometer high-voltage process (XH018), to provide improvements in reliability and efficiency by addressing the high-voltage and driver characteristics of mixed-signal SOC designs. Read more

January 11, 2012 Intel has provided details of its Medfield 32-nm platform for smartphones claiming that the main SoC consumes less than 800-mW worst case. It has also announced that it has deals in place with Lenovo and Motorola for products based on Medfield to appear in 2012. Read more

January 4, 2012 GreenPeak Technologies has launched the company's new GP570 chip that allows the development of low cost motion-enabled remote controls, addressing the growing demand for smarter and intuitive navigation of interactive entertainment services offered by operators. Read more

December 27, 2011 Teetering on the brink of 2012 we can now unveil EE Times Europe Analog's Top 10 most popular news stories of 2011. The results are based on the news stories that were accessed by EE Times Europe Analog's readership since January 1, 2011. Read more

December 15, 2011 ARM Holdings plc., and Globalfoundries Inc., have announced the tape out of a 20-nm chip and have demoed a Cortex-A9 SoC operating at more than 2.5 GHz on 28-nm technology. Read more

December 13, 2011 Microsemi Corporation has released Libero SoC v10.0 which is a new version of the Libero integrated design environment (IDE) offers system-on-chip (SoC) designers several new features, including improved ease-of-use, increased integration of the embedded design flow and a “pushbutton” design capability. Read more

December 13, 2011 ST-Ericsson and Fench research lab CEA-Leti have developed a three layer stack of multi-core system on chip devices all connected by the same network on chip (NoC). The 3D stack uses Wide I/Os to connect the SoC devices and a DRAM memory chip in what the researchers say is the first proof of concept for a 3D multiprocessor architecture. Read more

December 9, 2011 French design startup Starchip is working with Crocus to embed magnetic logic into system-on-chip devices. Read more

December 6, 2011 Picochip has launched the company's next generation of public access and enterprise silicon. The new devices are the PC3024 for enterprise use and the PC3032 for metro and rural small cells. The devices are the latest members of Picochip's market leading family of small cell System-on-Chip (SoC) products, and build  on the success of the PC323 and PC33 - the latter being the first SoC on the market for the new breed of 'small cell' and 'metro cell' basestations. Read more

December 6, 2011 Renesas Electronics' SuperSpeed USB (USB 3.0) SATA3 bridge system-on-chip (SoC), part number, µPD720230, has passed the certification testing by the USB Implementers Forum (USB-IF). AMD has also tested and verified chipset compatibility with Renesas' performance-enhancing UASP software for external storage devices. Read more

December 6, 2011 Texas Instruments Incorporated has unveiled an expansion of its KeyStone multicore architecture for emerging cloud radio access network (C-RAN) applications and network server developers. Specifically, TI is scaling its KeyStone SoC architecture for the emerging paradigm of C-RAN base stations, enabling the creation of device pools with immense capacity for manufacturers to develop high performance and power efficient C-RAN base station clusters. Read more

November 22, 2011 Renesas Electronics Europe and Hilscher GmbH, a leading supplier of industrial communication systems and devices, are to cooperate on the development of a new system-on-chip (SoC) for future high-end motion controls and automation control products. The SoC that will be jointly developed by Hilscher and Renesas is planned to be launched as a new member of Hilscher's next-generation, high-end communication controller series to be named netX 4000.   Read more

October 6, 2011 STMicroelectronics and the Microsystems Technology Laboratories (MTL) of Massachusetts Institute of Technology have presented the results of an advanced R&D project targeting a low-power microprocessor technology at the 2011 European Solid-State Circuits Conference in Helsinki, Finland. Read more

October 5, 2011 X-FAB, a foundry group for analog/mixed-signal semiconductor applications, has qualified the Cadence Physical Verification System for the majority of X-FAB’s process technologies. Foundry qualification means that X-FAB has given its stamp of approval for silicon accuracy of the Cadence Physical Verification System across all of its process nodes, and that mixed-signal customers can reap new performance and productivity advantages enabled by its tight integration into the Cadence Virtuoso and Encounter flows. Read more

September 27, 2011 Texas Instruments Incorporated has introduced new sub-1 GHz 6LoWPAN solutions, aimed at providing a gateway for remote, low-cost wireless sensors to connect to the Internet and a wireless extension of wired IPv6 infrastructures. By operating in the sub-1GHz band, TI’s 6LoWPAN solutions offer longer wireless range at lower power levels than traditional 2.4 GHz-based 6LoWPAN offerings. Read more

September 20, 2011 Fujitsu Semiconductor Limited has adopted Cadence signoff design-for-manufacturing (DFM) technologies for the company’s complex 28-nm ASIC and system-on-chip (SoC) mixed-signal designs. Deploying the Cadence DFM offerings is helping Fujitsu Semiconductor engineers ensure high yield, predictability, and a faster path to Silicon Realization for next-generation chips that will serve as the brains of the company’s advanced consumer electronics. Read more

September 9, 2011 The chip, part of ST’s latest-generation home entertainment platform, will support a wide variety of open-source environments to provide value-added services such as state-of-the-art gaming, Over The Top (OTT) video playback via 3rd-parties over the Internet, app stores and secure High-Definition streaming to tablets, smartphones, PCs and TVs throughout the home. Read more

August 30, 2011 Texas Instruments Incorporated has launched ten Bluetooth low energy technology (Bluetooth v4.0) profiles with associated sample applications to boost market development of Bluetooth low energy-compliant sensor devices. The Bluetooth low energy application software is a part of TI's BLE-Stack, and is available royalty-free to all using TI's CC2540 Bluetooth low energy system-on-chip (SoC). Read more

July 22, 2011 Wolfson Microelectronics plc has unveiled what the company claims is the world's first Audio System-on-a-Chip (SoC), integrating a high performance, low power, multi-channel Audio Hub, with full transmit path (Tx) noise cancellation, receive path (Rx) noise cancellation and Wolfson's myZone adaptive Ambient Noise Cancellation (ANC) technology in one device. Read more

June 2, 2011 Maxim Integrated Products has acquired privately held Calvatec Ltd, based in Edinburgh, Scotland. Calvatec is a provider of highly integrated analog mixed-signal solutions with breakthrough IP as well as leading design methods and flows for analog SoCs. Calvatec employs 15 people. Read more

May 31, 2011 Front-end IC design services and system solutions provider, EnSilica, is to collaborate with silicon Intellectual Property (IP) provider, Evatronix SA, to offer fully featured eSi-RISC processor SoC solutions incorporating USB 1.1, 2.0 and 3.0 connectivity. Read more

May 9, 2011 Posedge, a semiconductor intellectual property and solutions provider based in Sunnyvale (California, USA), has licensed EnSilica'sa high-performance eSi-3250 32-bit processor core for an innovative, new Residential and SMB Gateway solution that performs Wire-Speed Routing at multi-gigabit rates. Read more

May 5, 2011 STMicroelectronics' Sound Terminal digital audio SoC supports up to 50W of output power, without requiring any external heatsink. The STA350BW has digital audio processing on the chip and features performance enhancing innovations pioneered by ST such as Multiband Dynamic Range Compression (MDRC), which boosts audio clarity and system reliability. Read more

May 3, 2011 Lattice Semiconductor and Oregano Systems Design & Consulting announced the immediate availability of three comprehensive versions of the IEEE-1588 Timing Node System IP core for the LatticeECP3 and LatticeECP2M FPGA families. These SoC-class versions of the IP core are characterized by different levels of functionality and performance. Read more

April 8, 2011 Maxim Integrated Products has launched a new Teridian/Maxim energy-measurement system on chip (SoC). The 78M6613 is the industry's first SoC energy-measurement solution for AC/DC power supplies that brings a higher level of management and control to servers and other equipment in data centers. Read more

March 28, 2011 iWatt has adopted Magma Design Automation's Titan platform to improve analog design and layout productivity, and to automate difficult routing tasks including analog cell layouts and chip-level assembly. Read more

March 11, 2011 Freescale Semiconductor claims to have introduced the industry's first system-on-chip for the two-way radio market. The MC13260 consists of an integrated 32-bit ARM-9 processor, a software defined modem, an RF transceiver and audio converters specifically designed for the two-way radio market. Read more

March 7, 2011 PMC-Sierra, Inc., is claiming the industry's most advanced EPON ONU devices with integrated Optical Analog Front End (OAFE) technology optimized for the rapidly-growing Fiber-To-The-Home (FTTH) market segment. PMC-Sierra's PAS6500 family consists of three devices – the PAS6502 System-on-Chip (SoC) for data and voice-over-IP (VoIP) Single-Family Units (SFUs), the PAS6500 SoC for data SFUs, and the PAS6501 SoC for Multiple Dwelling Units (MDUs).   Read more

March 7, 2011 Maxim Integrated Products is launching a new Teridian/Maxim energy-measurement system on chip (SoC). The 78M6613 claims to be the industry’s first SoC energy-measurement solution for AC/DC power supplies that brings a higher level of management and control to servers and other equipment in data centers. Read more

March 2, 2011 Cadence Design Systems, Inc. has extensively expanded its broad portfolio of verification IP (VIP) and memory models, which delivers a robust verification solution spanning silicon, SoC and system development. The Cadence VIP offering will support new protocols such as ARM AMBA 4 and MIPI to address early IP verification and integration through to system validation in demonstration of the EDA360 vision. Read more

February 23, 2011 ChipWrights released a new colour pipeline solution for cameras using non-System-on-Chip (SoC) sensors based on ChipWrights’ CW5631 SoC. The solution requires a CW5631 SoC and a DDR2 DRAM; it can be employed in tandem with a second CW5631 SoC, which can be used as a system processor or as a stand-alone image sensor pipeline in existing camera designs. Read more

February 3, 2011 Ivo Bolsens, chief technology officer of field programmable gate array vendor Xilinx Inc., sees a future where FPGAs are a fundamental part of the system-on-chip, either merged monolithically with software programmable microprocessor cores or making use of multi-die configurations in three dimensional system-in-packages. Read more

February 1, 2011 Toumaz launched the TZ1053 Telran, an ultra-low energy (ULE) radio for wireless sensor networks, remote controls, green energy solutions, smart meters, and environmental monitoring. Built on the company’s proprietary AM Mixed Signal technology, the sub-1GHz radio SoC offers 1V operation using a single button cell battery and consumes less than 3mW continuous use power consumption. Read more

January 27, 2011 Intersil Corporation has introduced a new family of single-chip audio system solutions that provides improved audio quality in consumer products. The company claims the new devices will offer a revolutionary high-end audio experience in an easy-to-implement and affordable single-chip solution. Read more

January 10, 2011 Analog Devices, Inc., has introduced two of the industry’s smallest and thinnest low-power transmitters to incorporate HDMI version 1.4 specification support for 3-D display resolutions and extended colourimetry. With a 25 percent smaller footprint than competing offerings (3.45 mm x 3.45 mm x 0.505 mm), ADI's low-power transmitters - the 80 MHz ADV7525 and the 150 MHz ADV7526 - enable mobile device designers to achieve new levels of miniaturisation, flawless HD video performance and power efficiency. Read more

December 15, 2010 Telegent Systems has introduced its fourth generation TLG1123 analog mobile TV receiver. This mobile TV chip introduces new algorithms for improving TV picture quality and viewing experience while continuing to reduce size and power consumption compared to the widely adopted TLG1120. Read more

December 13, 2010 Microsemi Corporation has adopted Sibridge Technologies' Verification Intellectual Property (VIP) to reduce time to market for its innovative FPGA and customizable SoC products. Sibridge Technologies is a provider of innovative ASIC/FPGA, design and verification IPs and embedded systems solutions. Read more

October 5, 2010 LSI Corporation has unveiled a 40 nm application specific standard product (ASSP) system-on-a-chip (SoC) for the notebook and desktop hard disk drive (HDD) market segments which offers HDD OEMs lower development costs and accelerate time-to-market. Read more

September 3, 2010 Cypress Semiconductor Corp., has unveiled new features for the company's PSoC Creator Integrated Development Environment (IDE) for the PSoC 3 and PSoC 5 programmable system-on-chip families. PSoC Creator now supports enhanced low-power design techniques, new LCD design capabilities and faster, easier CapSense capacitive sensing design.  Read more

July 28, 2010 Virage Logic Corporation, is broadening the company's extensive System-on-Chip (SoC) infrastructure IP portfolio with its new Integraproduct line. Read more

July 27, 2010 Virage Logic Corporation has expanded the company's broad semiconductor IP product portfolio with the introduction of SiANA, a new offering of silicon-proven analog IP components essential for building multimedia consumer electronics devices. Read more

July 27, 2010 Virage Logic Corporation has released the company’s ARC Sound AS221BD dual-core processor for High Definition (HD) Audio System-on-Chips (SoCs) targeting Blu-ray Disc 7.1 channel 192 kHz/24-bit output HD Audio processing applications. Read more

July 13, 2010 Earlier this month Analog Devices, Inc., unveiled an innovative16-bit 4-channel control IC featuring Dynamic Power Control circuitry which claims to offer four times greater channel density, up to 80 percent power savings together with a 75 percent reduction in thermal rise. Read more

June 14, 2010 Researchers at IMEC are looking at the use of silicon transistors in the sub-threshold region of their operation as a way of pursuing ultra-low power goals. A future SoC for biomedical applications could have blocks designed to operate at 0.2 or 0.3 V, researchers said. Read more

June 8, 2010 Taiwan Semiconductor Manufacturing Company has extended its Open Innovation Platform with another focus on system-level design, analog/mixed-signal (AMS)/RF design and two-dimensional/three-dimensional integrated circuit (2-D/3-D IC) implementation. Read more

May 25, 2010 Virage Logic Corporation has expanded suite of certified, fully-optimized audio codecs that provide users with a robust and complete solution for a broad range of System-on-Chip (SoC) audio applications. Read more

May 24, 2010 High-performance mixed-signal semiconductor solutions provider for the consumer electronics market, Wolfson Microelectronics plc, has selected SiliconGate a specialist supplier of power management IP for ASIC/SoC, to provide high-performance power management IP in a four-year contract. Read more

May 10, 2010 ASIC design foundry and custom SoC solutions provider, VeriSilicon Holdings Co. Ltd., and On2 Technologies Finland Oy , have agreed a wide-ranging partnership that adds the multi-format video encode/decode solutions from On2 Finland to VeriSilicon's expanding, system level star IP portfolio. Read more

March 24, 2010 Synopsys has announced that Nationz Technologies, Inc. has successfully achieved first-pass silicon success of a 2.5-GHz, 126-channel RF transceiver system-on-chip (SoC) design by using Synopsys' CustomSim mixed-signal and VCS functional verification solutions, part of Synopsys' Discovery Verification Platform. Read more