Tronics prototypes piezoresistive 6DOF sensor
The 4 square millimeter die includes three accelerometers and three gyroscopes and Tronics claims it is one of the smallest 6DOF die in the industry with scope for further optimization to make it the smallest.
The piezoresistive nanowire technology (see Piezo-nanowires boost fingerprint resolution) allows manufacture of multiple sensor types, including accelerometers, gyroscopes, magnetometers, pressure sensors and microphones, in a single manufacturing process technology and increasing opportunities for monolithic integration.
The sensor sensitivity, power consumption, and noise characteristics are in line with the design models, Tronics said. Industrialization work will continue during 2014 and samples are due to be available in 4Q14. An ASIC is also being designed to complete the sensor platform. Tronics has also designed a 9DOF monolithic MEMS.
"Tronics is delighted to have already partnered with a leading customer and we are very pleased to dramatically reduce time to market and enable superior end product performance," said Pascal Langlois, CEO of Tronics Group, in a statement.
Tronics is a MEMS foundry that operates production sites in Grenoble, France and Dallas, Texas, delivering a broad range of MEMS devices from tested wafers to integrated packaged components.
Related links and articles:
- Temperature & humidity sensor development demo, in distribution
- Continental starts production of sensor for NOx killer
- Panasonic develops 123dB dynamic range image sensor
- Image sensor works under starlight illumination
- Flexible pressure sensor aids breast cancer detection
- Himax launches 'always on' image sensor
- Wireless brain sensor monitors then dissolves
- Tower, PixelPlus embed SoC in security image sensor
- PNI offers dead reckoning processor
- Gpixel expands image sensor line up
- China's GoerTek, Intel back force-sensor startup
- Infineon launches 3D image sensor chips for VR on smartphones
- TDK bids for Micronas
- TI offers IR sensor-SoC for depth sensing
- Radio powers autonomous temperature sensor
- FDSOI carries on despite ST re-org, says COO
- Spice up your Pi for IoT development
- ST exits STB chip business, plans lay-offs
- NXP embraces 28nm FDSOI for MCUs
- The analog way for quantum computing
- Report: Analog, TI both pass on Maxim purchase
- Vesper reveals GloFo as microphone maker
- Quantum computing near and disruptive, warns academic at Davos
- Analog Aficianados and the electronic construction kit
- Atmel drops Dialog, says Microchip's takeover bid is better
- Will Apple drive analog ICs?
- Microphone glitch hit ST's analog, MEMS sales in 2015
- ST offers infrared time-of-flight sensor
- Startup develops room-temp metallic "velcro" glue
- Intel protege pitches wireless SoC for IoT
- Analog ASICs: A Financially Viable Alternative to Standard Products
- Industry¬ís First 0.8μVRMS Noise LDO Has 79dB Power Supply Rejection Ratio at 1MHz
- The Advantages of Capacitive vs Optical Encoders
- High Voltage CMOS Amplifier Enables High Impedance Sensing with a Single IC
- Engineering Change Order and Implementation
- Low Power Bi-directional Level Shifter
- Haptic advancements put us in touch with complex systems