In addition to memory models and VIP obtained from last year's acquisition of Denali, complementing the metric-driven Cadence VIP, the expanded offering now supports all major third party simulators, effectively providing designers a one-stop shop of mainstream and emerging protocols for developing and verifying today's advanced electronic designs.
Specifically focused on accelerating the verification process and product delivery, Cadence's VIP Catalog covers more than 30 complex and emerging protocols and is included in an expanded VIP Catalog that features:
- Support for third-party simulators across the entire portfolio to enable all customers to deploy Cadence VIP on top of existing environments, and extended support of the Universal Verification Methodology (UVM)
- Expanded protocol availability, featuring early delivery of verification IP for emerging protocols such as the AMBA 4 specification, the latest MIPI protocols (M-PHY, DigRF and UniPro), PCI Express Gen 3, SuperSpeed USB, and Ethernet 40/100G, as well as new memory models including DDR4, LRDIMM, and Flash ONFI 3.0.
- New use models, including system validation with new accelerated VIP that addresses hardware/software integration and a new SoC Portfolio that makes SoC verification more cost effective, and a roadmap for extending the solution to enable software-driven verification, a new approach providing a programmer's view of system verification.
“Verification continues to dominate project schedules and costs, with companies expending tremendous efforts on IP and SoC verification and on ensuring system correctness,” said Nimish Modi, senior vice president of the System Realization Group at Cadence. “With our expanded VIP offering, customers now have access to a vast and comprehensive set of verification IP targeting IP, SoC and system development. Along with the enhanced features and capabilities of the portfolio, this helps our customers significantly improve their competitiveness through delivering higher quality products and accelerating time to volume.”
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